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TOPICS
The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation.
Consequently, both theoretical as well as applied research contributions are encouraged.
The topics of the Workshop include but are not limited to:
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Signal Integrity
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High-Speed Interconnects and high-speed channels
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Power Integrity/ Ground Noise
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Power Distribution Networks
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Electronic packages and microsystems
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3D technologies for ICs and packages
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RF, Microwave packaging and mixed signal systems
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Nano-Interconnects and nano-structures
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Electromagnetic Theory and Modeling
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Transmission Line Theory and Modeling
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Macro-Modeling, reduced-order models
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Advanced Simulation Tools for Signal and Power Integrity
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Electromagnetic Compatibility
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Coupling Effects on Interconnects
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Radiation & Interference
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Testing & Interconnects
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Time and Frequency Domain Measurement Techniques
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